与对应的无类型超接口相反。
清单 2 中的字段和方法签名利用了与超接口签名相同的变量格式类型，其他都与前面介绍的内容相同。
The field and method signatures from Listing 2 make use of the same type of variable format as seen in the superinterface signature, but aside from that, they don't show anything new.
这个超层的作用是封装作为正式的跨层接口结构中的 RUP 构件（ 软件服务）设计的组件。
This super-layer is to encapsulate components that are designed as RUP artifacts (as software services) within a formal, cross-layer interface structure.
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