目前，纯锡镀层的焊接可靠性差，锡基二元合金镀层有脆性大、润湿性差等方面的问题，贵金属镀层成本高。
At present, pure tin deposit has a bad solder reliability, tin-based binary alloy deposits have big brittleness or bad wettability, and noble metal deposits have high price.
适合一些外形复杂、对镀层均匀性和质量要求高的工件的电镀，如贵金属电镀等。
Rotating electroplating would be suitable for product of complex shape, the high requirement for the quality and coating uniformity, such as noble metal plating etc.
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