它揭示了引起制程变异的因素，但不能确定是否允收一个有可能不良的批次。
Use Xbar and R charts to discover the factors that contribute to process variability. Shewhart charts cannot ensure against accepting poor or recallable lots.
为了克服制程、电压、温度变异所造成的影响，自动时脉偏移同步方案可以在晶片制造出来之后动态地调整并降低时脉偏移。
To overcome the influence caused by PVT variations, the automatic skew synchronization scheme can dynamically adjust and reduce the clock skew after a chip is manufactured.
应用推荐