"表面组装技术"是个多义词，它可以指表面组装技术（人民邮电出版社出版书籍）,表面组装技术（中国科学技术大学出版社出版书籍）。
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
《表面组装技术》于2003年创刊，由香港雅时国际商讯出版及发行，每年出版6期，以简体中文发行。
SMT China magazine was launched in 2003, published by ACT International in Hong Kong, 6 issues per year in Simplified Chinese.
表面贴装技术是第四代电子组装技术，片式铝电解电容器是这一技术中不可缺少的元件。
In SMT used as the fourth generation of electronic mounting technology chip aluminium electrolytic capacitors are indispensable components.
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