在多冲载荷作用下，零部件大都会在其接触表面出现宏观可见的变形，并引发各种缺陷，从而导致零件损伤失效。
Under the effect of this kind of load, there are microscopic deformations and various disfigurements appear on the contact surface of the parts, and then lead to damage and failure.
在硅片研磨过程中，由于应力的积累和剧烈的机械作用，硅片表面损伤严重，碎片率增加。
In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action.
指出拉伸断裂是表面与内部损伤共同作用的结果。
It may be concluded that tensile fracture is caused by the combined effects of surface and internal damage.
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