本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。

Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.

youdao

嵌入式无源元件技术能够实现对电容、电感等无源元件在印刷线路板内部的嵌入式封装，从而节省线路板表面空间、提高封装密度。

The embedded passive technology can save the real estate on the surface of the printed-circuits-boards (PCBs) by embedding the capacitors and inductors inside the PCBs.

youdao