这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL 塑料封装内，其引脚可用于表面安装和回流焊接。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
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