按客户要求的规格和形状在硅片表面切割出具有一定深度的沟槽。

Cutting groove grids on wafer surface in a special size and shape depends upon the costumers needs.

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这意味着钻石能切割其他任何表面，而且只有用钻石才能对其他钻石进行微小的切割。

That means a diamond can cut any other surface. And only another diamond can make a slight cut in a diamond.

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需焊接或热切割的表面应排除所有可能会损坏焊材或母材的杂物，如脂、油、灰尘、水垢、熔渣和油漆等。

Surfaces to be welded or thermally cut shall be cleaned of all foreign material such as grease, oil, dirt, scale, slag and paint that would be detrimental to either the weld or base material.

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