一种用于形成用于将焊料转移到晶片的焊料模的方法包括将多个焊料腔蚀刻到基板中。
The method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate.
在所述基板上蚀刻连接所述多个焊料腔的多个排气通道。
A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.
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