选用微带线和衬底接地的共面波导等不同结构的电感实现形式，充分利用了芯片面积。
In this chip, inductors are realized with microstrips or grounded coplanar waveguides according to their actual position, so the chip's area is reduced.
放大器采用共源共栅结构，芯片内部埋置了螺旋电感。
The amplifier employs cascode structure, and spiral inductors on chip.
因为在印刷布线板10内设置了片状电容器20，所以能够缩短IC芯片90与片状电容器20的距离，降低环线电感。
Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance.
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