企业介绍:我社nts是芯片加工(wafer back grinding) 设备专业厂家,在很多的制造设备经验和新技术基础上,受到国内、外很多led芯片制造公司的关心和支持。
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提出使用CO2激光器进行PMMA微流控芯片加工的方法。
We used CO2 laser system to fabricate polymethylmethacrylate (PMMA) based microfluidic chip.
分析了芯片加工中器件损伤的物理机制并给出了减小损伤的方法。
In the paper the mechanism of device damage in chip processing is analyzed. And some methods to decrease the damages are given.
研究了激光功率,频率,扫描速度等参数及加工程序对芯片加工质量的影响。
The effects of laser power, frequency, writing speed and procedures on the quality of the chip was evaluated.
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