印刷电路板组装与测试 Printed Circuit Board Assembly and test
半导体组装与测试服务 semiconductor assembly and test services
组装与系统测试阶段 IT&ST Integrating and System Testing phase
本文通过设计制作“无源耦合组件组装与测试平台”解决耦合组件的组装和测试耗时过长和精度较低的问题。
We designed a assembling and testing bed for passive coupling assembly, which solved the problem of unreasonable long time and low precision of assembling and testing process.
该平台基于压电陶瓷执行器件，采用计算机控制，除达到了高精度快速地组装与测试的基本功能，还具有过程自动化的特点。
The bed are based on piezoelectric ceramic device and controlled by computer. It reaches the goal of high precision, quick assembly, and automatic operation at the same time.
此外，在“交付之前”阶段上册建筑与内部组装之间，会执行一些主要的测试，对详细海域试验会执行符合性审计。
Additionally, major tests are carried out at 'pre-delivery' stage between superstructure and interior assembly and in the detailed seas trial and compliance audit carried out posconstruction.
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