薄膜硬度通过纳米压痕仪进行测量。

The hardness was measured by nano-indentation of CSEM.

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研究了纳米晶体铜材料的压制工艺条件对其相对密度和显微硬度的影响，并用正电子湮没寿命谱、扫描电镜和热重分析仪对其微观结构进行了表征。

The influence of relative density and microhardness on pressing parameter of nanocrystalline Cu was studied, and its microstructure was characterized by PAS, SEM and TG.

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同时，采用DSC和纳米压痕仪等仪器，测试薄膜的相变温度、显微硬度和弹性模量。

Meanwhile, the phase transition temperature, micro-hardness and elastic modulus were analyzed by DSC, nano-indenter and the other instruments.

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