微测辐射热计fpa的热设计是非致冷红外探测器设计的难点和关键。
The thermal design of the microbolometer FPA is a difficulty and key problem when an uncooled infrared microbolometer detector is designed.
热敏薄膜电阻制备是非致冷微测辐射热计红外焦平面的一项关键技术。
Preparation of thermal sensitive thin film resistor is one of key technologies in uncooled micro bolometer IR FPA fabrication.
本论文对实现基于MEMS工艺技术的非制冷型红外测辐射热计的两个主要关键内容进行了深入研究,即敏感器件结构的设计和整个制造工艺流程的合理设计。
Study on designing of sensor device's structures and whole reasonable fabrication process, which are two key issues of uncooled infrared bolometer that based on MEMS technique.
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