突然间苍蝇发现它自己被倾盆而下的粘胶粘住身子，犹如落入古罗马军团百夫长的网罩中。
Suddenly the fly finds itself pinned-under a downpour, of glue, as if in a Roman centurion 's net.
针对集成传感器芯片封装粘贴过程中的残余应力影响器件性能的问题，使用有限元方法对环氧粘胶粘贴集成传感器芯片产生的封装残余应力进行了分析。
To investigate the sensor packaging effect, the finite element method is adopted for analyzing the distribution of residual stress in the multi-sensor chip with FR4 substrates.
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