光照射到这个感应芯片上面然后从硅原子中激发释放出电子，这样就产生了一个电信号然后通过芯片的电子器件转化成图像。
Light striking this detector liberates electrons from some of the silicon atoms, producing an electrical signal that is converted by the chip's electronics into a picture.
玻璃板上的图像，然后转移到镍硅晶片，简称为“垫片”。
The image on the glass plate is then transferred to a nickel die, referred to as the "shim".
本文利用图像分析技术，系统研究了非金属夹杂物对等温淬火高硅铸钢力学性能的影响。
Effect of inclusions on mechanical properties of the high silicon cast steel was experimentally studied by using image analysis method.
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