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此芯片集成化程度较高，可以补偿硅压阻式压力传感器的温度误差和非线性误差。
It is mainly used to compensate temperature shift and non-linearity error of piezoresistive pressure sensor.
在金属圈内滴封包封胶，填充在硅压阻式压力传感器的四周，隔 绝传感器芯片与外界环境的接触。
Sealing gel is dripped into the metal ring and filled around the silicon piezoresistive pressure sensor, so as to isolate the chip of the sensor from the outside environment.
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