内的空气转折真空细胞会只想把喜欢的立场转折顶端，因为陀螺的力量。
Air inside turning vacuum cells will only want to turn like the position of the turning top, because of gyroscopic forces.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
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