QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
功耗不但直接影响芯片的封装形式与成本，而且过高的功耗将导致芯片温度的增加，直接决定着芯片的可靠性。
Power consumption not only affects chip package type and cost, also causes the increase of chip temperature, which will decide the reliability of chip directly.
这种逻辑以模块组件的形式封装在流程代理程序中，这些模块可以组合成分层的业务流程。
This logic is encapsulated within the Process Brokers as modular components that can be composed into hierarchical business processes.
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