影响铝栅板上铅镀层孔隙率的因素探究 关键词：电镀铅；铝栅板；孔隙率 [gap=6268]Key words：lead electroplating；aluminum grid plate；factor of porosity
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介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。
Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.
锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅的替代品仍然不切实际。
No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.
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