球形键合 Ball bond
键合球 bonded ball
热压超声球引线键合 Thermo-sonic ball wire bonding
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本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。
In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.
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基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
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