Failures occur frequently in glass solder about shear strength test. The frame width of glass solder after bonding is increased excessively.
对键合后封装单元进行剪切强度测试发现失效主要位于玻璃焊料中。
参考来源 - 微机电系统晶圆级玻璃焊料密封的工艺研究及热应力分析·2,447,543篇论文数据，部分数据来源于NoteExpress
玻璃焊料的选择与相应的工艺参数对封接件质量起着重要作用。
The selections of glass solders and the corresponding technological parameters are important to the quality of the sealing.
玻璃焊料线宽对热应力影响不大，厚度和键合温度越大热应力越大。
There is only a small influence of the bond frame width of glass solder on the thermal stress.
通过有限元法对键合热应力进行分析，得到热应力最大值位于玻璃焊料与硅片接触面的外拐角处，其次是玻璃焊料内外边缘处；
The finite element analysis shows that the maximum thermal stress is in the outside corners of the glass solder. The thermal stress in the edges of glass solder is also high.
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