是一种难燃的片状材料。
具有窗口的片状材料，其制造方法，以及包括该片状材料的安全文件。
Material in sheet form having a window, its manufacturing method, and security document comprising it.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
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