... 储存温度Storage Temperature 焊接条件Solder Temperature 发光颜色 多色 LED封装 无色透明封装(T) ...
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Reflow profile 回流焊要求 Soldering condition 焊接条件 Recommended soldering conditions 推荐焊接条件 Reflow Soldering 回流焊 160～180℃ Pre-heat 预热温度 120 seconds Max.
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和焊接条件（storage soldering conditions）:1、注意保存，保存条件不好时，会降低膜片与反射壳（导光板）的粘附力。
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在合适的激光焊接条件下，热影响区韧性高于母材；
The toughness of HAZ is higher than base metal under appropriate laser welding conditions.
焊接条件需要满足船东和船级社的检验要求。焊接需要在干燥和清洁条件下进行，尽量进行露天保护。
The welding conditions have to meet the requirements of class and Owners inspections. Welding shall be carried out under dry and clean conditions, weather protected as far as possible.
对于焊接过程中常出现各种干扰，焊接条件时有变化的TIG自动焊而言，改进传感方法和控制技术是提高焊缝质量闭环控制系统控制效果的两大途径。
Due to changing welding condition caused by interference in TIG welding process, to improve the sensors and its control is two ways to promote accuracy of closed-loop control of welding quality.
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