同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
吊车轨道的材料由于其含碳量较高， 强度大， 可焊性较差， 焊接时容易产生裂纹， 因此要严格按照工艺执行。
Material for rail of crane is of strong strength because of high carbon content, but of poor weldability, which makes more cracks. Strict technique is required in such welding.
可焊性：根据无铅焊接概况。
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