同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
填充材料：对于焊接，应使用与基材相匹配的填充材料。
Filler materials: For welding, base metal matching filler materials shall be used.
讲述了通过对材料、焊接方法的选择和焊口及工装设计与制造过程设计，来实现汽车传感器封装的方法。
Through material choice and welding method selection, by working equipment design and manufacture process design, this article explains the method to actualize automobile sensor sealed.
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