但9天之后一个简单的电气连接因为焊接不良过热造成伤害。
But nine days later a single electrical splice overheated because it had been badly soldered, and disaster struck.
过去的数据结合数个对于焊接不良有如桥接的实验设计和制程优化可达到最佳的通孔填充。
Historical data is combined with several Design of Experiments looking at solder defects like bridging and process optimizations to achieve the best hole filling.
利用声学扫描检测技术，提示了热烧毁的微波功率器件氧化铍陶瓷基片与底座金属散热片的焊接不良现象；
Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Scanning technique.
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