散热片与集成电路封装热接触用于在工作过程中提取热量。
The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
除尘作为热绝缘层，阻碍气流，从而减少了散热片和风扇的性能。
Dust acting as a thermal insulator and impeding airflow, thereby reducing heat sink and fan performance.
利用声学扫描检测技术，提示了热烧毁的微波功率器件氧化铍陶瓷基片与底座金属散热片的焊接不良现象；
Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Scanning technique.
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