讨论了正常熔化时间即断电前炉内状态对断电后钢液凝固和炉内温度变化的影响。
The effect of the initial state on the solidification process of liquid steel and the temperature changing inside furnace were discussed, respectively.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
本文介绍某厂CAPL均热室热工工况，包括均热室的供热特点、炉内温度分布及热平衡。
The thermal situation for the soaking chamber of CAPL. including heating characteristic. temperature distribution in the furnace and heat equilibrium.
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