概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。
Technics of LTCC MLB processing using thin film circuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.
激光束的强度极高，这就使它成为一种方便的钻孔工具。
The high intensity of a laser beam makes it a convenient drill.
在生产领域，激光可以用来钻孔、切割、连接、硬化以及进行表面改性和微加工。
In the area of manufacturing, lasers are used for drilling, cutting, joining, hardening, surface modification and micromachining.
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