By employing simple wet anisotropic etching process and metal sputtering (or evaporating) process, the electrical interconnect between the electrodes on both sides of the silicon wafer was realized for the first time.
在制备中笔者利用简单的各向异性湿法腐蚀工艺和金属溅射(或真空蒸发)工艺实现了将电极从硅片的一面引到另一面，该电极导引方法在本实验之前未见相关报道。
参考来源 - 基于MEMS技术的FabryLaminar flow assisted wet chemical etching.
三.层流辅助湿法腐蚀。
参考来源 - 微流控芯片中层流现象的研究与应用Preliminary studies on Si and SiO2 wet-etching were conducted.
初步进行了Si和SiO2的湿法腐蚀工艺的探索。
参考来源 - 半导体二维光子晶体增益与耦合特性的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
本课题的目的在于如何保护湿法腐蚀中芯片的焊盘和结构。
The purpose of this paper is to find ways to protect the pad and the structures on chip during the wet etching.
利用光刻胶形成保护侧墙，用湿法腐蚀来形成发射极钝化边沿。
With the protection of photoresist sidewall, the emitter passivation ledge is fabricated by wet etch.
在整套工艺环节中，光掩模版图设计和湿法腐蚀是两个关键步骤。
The mask design and the wet etching are both key processes in the technology introduced.
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