为了提高机架密度，IBM开发了一种新的模块化水冷和分布系统。
To increase the rack density, IBM created a new modular water cooling and distribution system.
这种混合系统可以减少每个机架的热量密度，并可有望获得最佳的密度。
This mix of systems reduces the heat density of each rack, potentially allowing for optimal density.
作为UPS系统的补充，高级缆式pdu可以置于高密度的机架环境或任何需要将电力分配给多个设备的地方。
Designed to complement UPS systems, advanced cabling PDUs can distribute power in high-density rack environments or anywhere conditioned power must be distributed to multiple pieces of equipment.
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