adj. intragranular
...的测试挑战,例如转变引起的故障(Transition Fault)和桥接引起的故障(Bridging Fault)、设计流程互动特性、以及晶粒内(Inter-die)和晶粒间(Intra-die)的变异(Variation)等。
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而塑性下降则归因于较薄薄膜的晶粒内较少的可动位错。
The decrease in the ductility of the microbeam is attributed to fewer mobile dislocations in the grain.
疲劳裂纹扩展阶段裂纹尖端附近为形成于铁素体晶粒内的位错胞及亚晶。
Dislocation cell and sub grain formed in ferrite grain are found at the stage of fatigue crack propagation in the area of crack tip.
结果表明：铬和锆在合金中多以化合物的形式存在， 且分布于晶界上和晶粒内；
The results show that alloy elements usually in form of compounds and distribute in the boundary of grains;
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