电路保护 DVD-ROM IC封装制程简介 晶圆切割(die sawing) 将晶圆切成颗粒状(die),切割前须先进行晶圆黏 片,然后在送至切割机上切割,注意切刀寿命、进刀 速度、转速、水流量及水质…
基于8个网页-相关网页
MOSFET的封装主要由晶圆切割,晶粒黏贴,焊线,封塑,切割成型这五大流程组成。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
直接硅片技术能直接在熔融晶中制成单片晶圆,不需要切割。
Direct wafer makes individual wafers straight from molten silicon-no cutting required.
更小的芯片通常意味着更快的速度,更低的能耗,更重要的是,它意味着更佳的预算——因为单个晶圆可以切割成更多的芯片。
Smaller chips usually mean faster speed, lower power consumption and, importantly, better margins-since more chips can be sliced from a single slab of silicon.
应用推荐