无铅焊点可靠性 Reliability of lead-free solder joints
Further the elastic-plastic constitutive equation for lead-free solder joint in microelectronics packaging is achieved.2、In this paper, power hardening creep constitutive equations,ε= Cσn, is used to describe the creep mechanical properties of lead-free solder joints.
进一步建立了微电子封装中真实无铅焊点的弹塑性本构关系。
参考来源 - 微电子封装中无铅焊点的实验研究与可靠性分析·2,447,543篇论文数据，部分数据来源于NoteExpress
三种焊锡膏均可形成饱满、光亮的焊点，锡铅焊点外观比无铅焊点更规整圆滑。
All of the three solder pastes could form plump and splendid solder point, and the appearance of Sn-Pb solder point was more regular and sleek.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
Through appearance testing, X-Ray testing and temperature cycling testing, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
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