还提供一种将无电电镀液施加至基板上的方法。
A method for applying an electroless plating solution to a substrate is also provided.
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
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