实现废弃pc B板上元件和基板的无损拆卸，一直是PCB回收的难点。
The realization of electronic components 'non-destructive unsoldering separation from PCB board has ever been a tough challenge for PCB's recycling.
对回收片、混淆片制定了可操作的无损快速分辨目前常用的压电基片的手段和规范，应用于生产。
To make the criteria and method with no loss and fasting resolution for received wafer and mixed-up wafer, apply to produce.
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