The focus of paper is that, based on LTCC packaging technology, integrate the millimeter-wave transceiver module into the LTCC multilayer substrate. This is an important step in the process of realizing compact, high-performance and low-cost millimeter-wave modules.
本文的研究工作主要是基于LTCC这种全新的封装技术,首次在LTCC多层基板上进行毫米波收发组件的集成,实现其基本功能,是毫米波组件向小型化、高性能、高可靠性方向发展所迈出的重要一步。
参考来源 - 毫米波LTCC收发组件研究·2,447,543篇论文数据，部分数据来源于NoteExpress
以下介绍两个主要的收发组件，一个是VCO另一个是混频器。
Two primary transceiver components, a VCO and mixer, are presented below.
数字收发组件高额的成本，限制了数字波束形成技术的普遍应用。
High quota cost of the digital receiving and dispatching module has limited the digital beam-forming technology of universal application.
研究了由单片微波集成收发组件所构成天线阵的可变极化扫描问题。
The beam scan with variable linear polarization directions of antenna arrays using MM/C transmit-receive (T/R) modules is explored.
应用推荐