第一基板包括接地平面，该接地平面安置在整个第一基板上方。
The first substrate includes a ground plane, which is deposited over an entirety of the first substrate.
研究对象包含了组成电源分配系统的电源模块，电源平面、接地平面、旁路电容和高速芯片的封装及内部电源分配等问题；
The research objects include power module, power plane, ground plane, bypass capacitor, encapsulation of high-speed chip and inside power distribution.
应用推荐