提供一在基板上形成超浅接合区的方法。
A method for forming an ultra shallow junction on a substrate is provided.
某些实施例中提供一在基板上形成超浅接合区的方法。
In certain embodiments a method of forming an ultra shallow junction on a substrate is provided.
利用场发射电镜、能谱仪等对接合区的界面和组织形貌进行了分析比较。
The microforms of diffusion joint were analyzed using field emission scanning electron microscope with an attached energy dispersive Xray analyzer.
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