介绍了热压成型的原理，并对微流控芯片热压成型机进行了总体设计。
The hot-embossing theory was introduced, and the hot-embossing machine of microfluitic chip was designed.
该技术是把有机泡沫微球作为成孔剂与热压注成型技术结合的制备技术。
The method combined the hot pressure casting-shaping technique with organic foam small-sphere as pore-making reagent.
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