微波高密度互连
Microwave high density interconnection
以上为机器翻译结果，长、整句建议使用 人工翻译 。
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
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