通过对界面回波和几何回形状回波之间的回波信号评估来分析产品部件，例如工件边缘回波，开孔之类的回波是来自几何形状回波。
The component analysis is carried out by evaluating the flaw indications between the interface echo at sound entry and the indications from the geometry, such as edges – openings – holes.
检测回波能量就可获知目标物的存在、位置、大小、形状、浓度及强度。
Detection of echo energy could reveal the presence of a target and its location, size, shape, density and intensity.
超声探伤中，由于声场特性、件几何形状的影响，所产生的各种回波信号常常被误判为缺陷信号。
It is often misjudged the flaw echo in ultrasonic examination that the echo signals produced by sound field property and geometrical shape of the component examined according to sound field theory.
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