在此之后，至少在接触开口(17)中以及在元件(6)的接触区域(7)形成导体材料，将元件(6)与导体层(4)连接。

After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4).

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当拉出钻头时，横梁(上面缠有绝缘体和导体的金属结构)将它架起，形成一个新的支架。

While pulling out the drill, crossbeams (metal structures on which insulators and conductors are mounted) are attached to a new support.

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它们通过对在半导体的两表层上通上电流后运行，这样既形成连续不断的电子也释放了光形式的电能。

They work by applying a current to two layers of semiconductor, which creates a flow of electrons and releases energy in the form of light.

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