表面组装元器件相邻引脚中心线之间的距离。 集成电路引脚间距离使用千分之一英寸或者毫米测量。 大多数默认为千分之一英寸（mil，密尔） 1mil=1/1000inch=0.00254cm=0.0254mm 以100 mil为基本长度对应的毫米距离为2.54mm
随着芯片集成度的增加和尺寸的减小，芯片引脚间距越来越细密化，微电子封装的精度要求越来越高。
As ICs continue to become more integrated and minimum feature sizes keep shrinking, the need for higher accuracy in fine pitch interconnect applications has become more important than ever.
阶段具有千分尺等级螺钉以及0.5毫米的引脚间距的特点，微型直线轴承和非接触式限位开关带有，任一步进机或直流伺服电机编码器的选择。
Stage features micrometer grade screw with lead pitch 0.5 mm, miniature linear bearing and non-contact limit switches with a choice of either stepper or DC servo motor with encoder.
引脚的边缘和阻挡层必须至少有半数的最小间距离开单元的边界。
The edges of pins and blockages must be at least one half the minimum spacing away from the cell boundary.
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