结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
从阴极引脚接点互换和偏转线圈引线互换两个方面对“引脚线互换法”及其用法进行了阐述。
This article expatiates the lead-foot-line reciprocation method and its usages from the two sides of cathode lead-foot joint reciprocation and deflexion loop down-lead reciprocation.
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