结合GB150 - 1998完成封头，筒体等主要部位加工工艺过程卡，根据产品工艺流程图，完成产品总装工序过程卡。
GB150-1998 with complete head, cylinder and other major parts of the process of card processing technology, according to the product flow chart, complete product assembly process during card.
第四章给出了具体的探卡整个工艺流程、实验结果以及探卡局部的SEM照片，最后给出探卡的导通电阻测试结果，符合预期目标。
In chapter4, the whole fabrication process, experiment results and some SEM photos are given. At last, the resistance of the probe card is measured, and the results meet our request well.
第三章对探卡工艺流程中的关键步骤进行了工艺试验，得到关键工艺参数，也同时验证了整个探卡工艺的可行性。
In chapter3, some experiments are conducted to get the key parameters of the fabrication process, at the same time, the feasibility of the process is proved.
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