这些变化都加快了电沉积速度，使高速局部电镀有可能实现。
All these changes enhance electrodeposition rates, thus high-speed selective electroplating can be reached.
归纳了局部电镀件的各种绝缘方法，详细介绍了各方法的工艺过程及优、缺点。
Insulation methods for local electroplating were reviewed. Procedures of these methods as well as strengths and weaknesses thereof were described in detail.
应用推荐