也介绍了测温传感器结构小型化方面所做的工作。
The miniaturization of current temperature sensor is also dicus-sed.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装,完成了传感器的一体化,实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
此方法还省去了偏振片,促进了SPR传感器的小型化、集成化。
This method reduces the polarizer and promotes the miniaturization, integration of SPR sensor.
应用推荐