减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
高速ASIC封装的电性能参数包括传输延迟、特性阻抗、信号串扰以及封装电感和电容等。
The electric characteristic parameters of package for high speed ASIC include propagation delay, characteristic impedance, cross talk, parasitic inductance and capacitance.
详细说明：Factory模式的两个最重要的功能：1定义创建对象的接口，封装了对象的建；2使得具体化类的工作延迟到了子类中。
Factory mode two most important functions: 1 the definition of an object to create an interface that encapsulates the construction objects 2 makes specific class work delayed to subclasses.
应用推荐